Plates for Wafer Production

	vacuum chucks
	gas-tight covers for nitrogen or vacuum
	lift pins for contact or proximity baking
	heat-cool feature

Vacuum Chuck hot plates 
 

Wenesco's hot vacuum chuck utilizes high uniformity heaters controlled with an accurate digital thermostat to assure even heating across the entire plate. Thewafer is secured to the plate surface when air is suctioned out of the vacuum chuck. The temperature sensor, imbedded in the vacuum chuck, monitors and maintains the selected temperature, thus controlling the cure rate of fluid materials deposited on the substrate or wafer. A hot vacuum chuck system may also include provisions for cooling the substrate after hardening, by shutting down the heat and directing a cooling gas flow towards the emulsion. This process integrates both the hardening and cooling operations and improves product throughput.  Other applications include probing, characterization, inspection and failure analysis of semiconductor wafers and chips, surface annealing, metal disposition, baking, and other material research. The standard sizes of hot vacuum chucks range from 15mm to 600mm . Temperature ranges for standard models are available to 537C, with higher temperature limits available for custom hot chucks.

Model HP66V hot plate with PV4 vacuum chuck	Model HP1212QPV3 hot plate, with fourindependent PV3  plate styles.  This feature is available with any plate style for chucks up to 24 x 24 in.
Model HP99V shown with optional pneumatic lift pins. The` pins can be actuated manually, or programmed using a time or temperature base.     Lift pins are further explained near the bottom of this page	Vacuum Chuck Hot Plates These versatile heated chucks provide a means for a simple, yet highly- controllable heat process for heating wafers to spec temperature during probing or testing.  All models feature a remote digital thermostat, which may be placed up to 32 in. from the plate. Set point and current temperature are digitally displayed in C or F, and temperature is held constant within 1% of set point. This thermostat may be programmed in a wide range of ramp and soak profiles.  An optional com port allows you to communicate with the thermostat from your computer An on-off valve is furnished for your vacuum supply. Vacuum rings and port are easily enabled or disabled with recessed set screws.
	Wenesco 3-zone hot plate Model HP4TV 3-zone vacuum chuck is designed for wet bench, proximity, or hard -bake process of semi-conductor wafers. The operator of this unique vacuum chuck places the wafers on the raised lift pins,which are set for desired height and time cycle.  At the end of the cycle the wafers are lowered and sealed with the vacuum.  A buzzer signals the operator when the cycle is complete. The plate material is anodized aluminum.  Electric and electronic systems are inside a hermetically-sealed stainless steel housing.  Each 4-inch diameter zone is controlled by its own programmable digital thermostat with a range of 29C-375C andtemperature accuracy of 1% of set point.

V models with vacuum chuck, up to 400C       Heat rise-20C per minute Model Plate size (in) Overall size (in)* Vacuum rings Plate surface. Flat to .005  power   HP66V 6 X 6 8 X 8 X 2 high pv3 or pv4 Aluminum, anodized 120/240 HP99V 9 x 9 11 x 11 x 2 pv3 or pv4 aluminum, anodized 120/240 HP1212V 12 x 12 14 x 14 x 2 select aluminum, anodized 120/240 HP1818V 18 X 18 20 x 20 x 2 select aluminum, anodized 120/240 HP2424V 24 X 24 26 x 26 x 2 select aluminum, anodized 240

HV models with vacuum chuck, up to 537C Heat rise-25C per minute Model Plate size (in) Overall size (in)* Vacuum rings Plate surface. Flat to .005  Power   HP66HV 6 x 6 10 x 10 x 5 pv3 or pv4 Stainless 303 120/240 HP99HV 9 x 9 13 x 13 x 5 pv3 or pv4 Stainless 303 240 HP1212HV 12 x 12 16 x 16 x 5 select Stainless 303 240 HP1818HV 18 x18 22 x 22 x 5 select Stainless 303 240 HP2424HV 24 x 24 28 x 28 x 5 select Stainless 303 240

NV Models with vacuum chuck and nitrogen hood, up to 400C Heat rise-20C per minute Model Plate size (in) Overall size (in)* Vacuum rings Plate surface. Flat to .005  Max temp (C) HP66NV 6 X 6 8 X 8 X10 high pv3 or pv4 aluminum, anodized 400 HP99NV 9 x 9 11 x 11 x 10 pv3 or pv4 aluminum, anodized 400 HP1212NV 12 x 12 14 x 14 x 10 select aluminum, anodized 400 HP1818NV 18 X 18 20 x 20 x 10 select aluminum, anodized 400 HP2424NV 24 X 24 26 x 26 x 10 select aluminum, anodized 400

HNV models with vacuum chuck and nitrogen hood, up to 537C  Heat rise-25C per minute Model Plate size (in) Overall size (in)* Vacuum rings Plate surface. Flat to .005  Max temp (C) HP66HNV 6 x 6 10 x 10 x 12 pv3 or pv4 Stainless 303 537 HP99HNV 9 x 9 13 x 13 x 12 pv3 or pv4 Stainless 303 537 HP1212HNV 12 x 12 16 x 16 x 16 select Stainless 303 537 HP1818HNV 18 x18 22 x 22 x 16 select Stainless 303 537 HP2424HNV 24 x 24 28 x 28 x 16 select Stainless 303 537

HOT CHUCKS FOR THIN FILM We also furnish 100% vacuum chucks from porous silicone carbide, aluminum, and stainless steel in a limited size and temperature range. A porous silicone carbide chuck, machined flat to .002, is shown near the bottom of this page.

Plate style PV3	Plate style PV4
Plate style PV6	Plate style PV8

 

Standard vacuum ring patterns

Plate PV3 Dia in / mm	Plate PV4 Dia in /  mm	Plate PV6  Dia in /  mm	Plate PV8  Dia in /  mm
.75     (19.05)	.75     (19.05)	75     (19..05)	75     (19..05)
1.75   (44.45)	1.75   (44.45)	1.75   (44.45)	1.75   (44.45)
3.75   (95.25)	3.75   (95.25)	3.75   (95.25)	3.75   (95.25)
	5.75   (146.05)	5.75    (146.05)	5.75    (146.05)
		7.75    (196.85)	7.75    (196.85)
		11.65    (295.91)	11.65    (295.91)
			15.25   (387.35)
			17.25   (438.15)

         

Chucks with gas-tight hoods, for nitrogen

Model HP1212HV is shown with a gas tight hood, fitted with a high temperature glass window. This fully insulated hood is 4 in above the heated chuck. The vented base shown under the heated chuck housing contains a motorized lift pin assembly. Lift pin speed is controlled up and down.	Interior view of motorized lift pin assembly. This version is controlled with a computer.
	Temperature uniformity for model HP 1212V ZONE Zone size inches Set pt 100C Set pt 200C Set pt 300C Set pt 400C A 2.4 x 2.4 100 200 301 400 B 4.8 x 4.8 99 199 298 398 C 7.2 x 7.2 97 193 296 385 D 9.5 x 9.6 92 189 290 380 E 12 x 12 81 183 278 360
Model HP1818 NV, shown here, has a tall gas-tight hood with nitrogen gas entering from the top. Operations (Nitrogen flow on,off )( Heat on,off) (Hood up,down) , are controlled with an optional timer. The optional light tower displays activation of these functions.     The polished stainless steel plate is 18 x 18 inches, and  operates at 450C	Model HP66V, with nitrogen hood removed, is shown with style pv3 vacuum pattern. The plumbing delivers and retrieves coolant through tunnels machined in the chuck. Chuck temperature is reduced from 300C to room temperature in approximately 25-30 minutes.

                              

Multi-Wafer Lift Pin Hot Plates This model is designed for proximity and soft baking.  A computer manages the step motor, which raise and lowers up to 10 wafers in one cycle. Position, speed, and dwell are precisely controlled. Process temperature is controlled with a digital thermostat up to 400C in a nitrogen environment. The cabinet and hood are made from stainless steel. The heated anodized plate measures 18 x24 inches, and a vacuum hood is available for hard bake. Click HERE to see the VIDEO.